WILMINGTON, Del., July 29 — Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.
As AI workloads, high-performance computing, and data-intensive applications demand more performance and efficiency, chipmakers are increasingly turning to chiplets, high-bandwidth memory, wafer-level packaging, 3D stacking, and heterogeneous integration — a shift from two-dimensional designs to more complex vertical architectures. Qnity is investing ahead of this transition with a differentiated platform that spans the full packaging ecosystem from front end to back end, including materials for patterning, planarization, metallization and interconnect technologies, advanced packaging solutions, and thermal management.
In the context of this investment, Qnity has joined hands with imec, the world-leading research and innovation center for advanced semiconductor technologies. As a member of its research program, Qnity gains deeper access to imec’s broad portfolio of research programs, world-class infrastructure and experts, and global ecosystem of industry and academic partners. The partnership is aligned with Qnity’s longer-horizon innovation agenda that will enable the next leap in computing, and strengthens the company’s ability to co-develop and accelerate next-generation materials innovation alongside the world’s technology leaders.
“Qnity is investing where the industry is going next,” said Randy King, Chief Technology Officer at Qnity. “As computing moves toward shrink and stack, advanced packaging is becoming one of the most critical frontiers for performance, efficiency and scale. Our collaboration with imec gives us deeper access to the ecosystem, infrastructure, experts, and partnerships needed to help shape that future, bringing next-generation materials innovation to our customers.”