New Delhi, March 12, 2026
The Indian Institute of Packaging (IIP) on Thursday began the 6th International Summit for Packaging Industry (ISPI 2026) in New Delhi, bringing together policymakers, industry leaders, academicians, researchers and innovators from India and abroad to discuss emerging trends and innovations in the packaging sector. The summit was inaugurated by Shri Ajay Bhadoo, Additional Secretary, Ministry of Commerce and Industry, Government of India.
The summit is being organised under the theme “Packaging 5S-AI – Safe, Secure, Standardised, Smart, Sustainable and Artificial Intelligence.” The theme reflects the industry’s growing focus on developing advanced packaging solutions that enhance product safety, strengthen supply chains, promote standardisation, integrate smart technologies and support environmental sustainability.
The inaugural ceremony began with the traditional lighting of the lamp. Shri R. K. Mishra, IRS, Director, Indian Institute of Packaging, delivered the welcome address and welcomed the distinguished guests and participants. Prof. (Dr.) Tanweer Alam, Additional Director and Regional Officer, IIP–Delhi, then presented an overview of the summit and outlined the key objectives and significance of the Packaging 5S-AI framework.
A key highlight of the event was the signing of a Memorandum of Understanding (MoU) and the inauguration of the Design Lab at IIP Delhi, aimed at strengthening innovation, research and skill development in the packaging sector.
In his inaugural address, Shri Ajay Bhadoo emphasised that the packaging sector is undergoing rapid transformation driven by digital technologies, sustainability priorities and evolving consumer expectations. He noted that the integration of automation and artificial intelligence can significantly improve productivity, reduce wastage and enhance product safety. He also highlighted that quality and standardised packaging play a crucial role in helping Indian products meet global standards, strengthening exports and improving their competitiveness in international markets.
The event also featured addresses by Shri P. R. Bantwal, Chairman, IIP and Chairman & Managing Director, Suprabha Protective Products Pvt. Ltd.; Shri Deepak Mishra, Joint Secretary, Department of Consumer Protection, Government of India; Mr. Ashok Chaturvedi, Chairman and Managing Director, UFlex Ltd.; and Ms. Luciana Pellegrino, President of the World Packaging Organisation, who joined the summit online.
Speaking on the theme, Prof. (Dr.) Tanweer Alam described Packaging 5S-AI as a transformative approach for the industry. He said that integrating safety, security and standardisation with smart technologies and artificial intelligence can strengthen traceability, improve quality control and enhance supply chain efficiency, while sustainability must remain central to innovation. He also highlighted initiatives such as One District One Product (ODOP) packaging support, cluster-based packaging development under government programmes, and the promotion of packaging standards aligned with APEDA specifications, aimed at strengthening packaging capabilities for regional and export-oriented products.
Highlighting the scale of the event, Prof. Alam said the summit has brought together around 1,500 participants, including policymakers, industry leaders, academicians and startups, along with nearly 50 international delegates from countries such as the United States, the Philippines, South Korea, Thailand, Nigeria, Ghana, Ethiopia, Botswana, Mauritius, Zambia, Cambodia, Sri Lanka, Uganda, the Maldives, the Gambia and Singapore.
The Indian Institute of Packaging (IIP) is also undertaking several initiatives to promote sustainable and innovative packaging solutions in collaboration with industry and government departments. Among its initiatives is the development of improved packaging for traditional products such as Nolen Gur from West Bengal, which has enhanced its portability and significantly increased its shelf life. The institute is also conducting training programmes for Self-Help Groups (SHGs) and Farmer Producer Organisations (FPOs) under initiatives such as the National Rural Livelihood Mission (NRLM) to help rural entrepreneurs adopt better packaging practices for agro and forest-based products. According to the institute, effective packaging can increase the market value of products by more than 10 percent, improving their marketability.
Through research, training and industry partnerships, IIP continues to strengthen India’s packaging capabilities while supporting exporters and manufacturers in ensuring that products reach global markets safely and in optimal condition. The discussions and collaborations at ISPI 2026 are expected to further accelerate innovation in the sector and contribute to the growth of India’s manufacturing and export ecosystem.
