Hanover, Md., Feb 26 — Building on its long history as the leader in high-speed connectivity – and marking the first product introduction following its acquisition of Nubis Communications – Ciena (NYSE: CIEN) is unveiling Vesta 200 6.4T CPX, the industry’s highest-density, lowest-power pluggable CPO solution. Designed to reduce power consumption by up to 70%, the solution helps hyperscalers, cloud providers, and data center operators evolve their architectures to reliably address AI workloads in both scale-out networks as well as next generation scale-up networks.
“We’re delivering the industry’s first truly flexible, open pluggable optical engine, removing barriers to CPO adoption and giving our customers exactly what they’ve been asking for: greater density, power efficiency, and reliability – all in an open, multi‑vendor ecosystem,” said Dino DiPerna, Senior Vice President of Global Research & Development at Ciena. “We continue to innovate in response to evolving customer needs, allowing operators to scale AI clusters more efficiently, using less energy and space, while lowering overall infrastructure costs.”
Vesta 200 6.4T CPX provides more power-efficient optical interconnect and delivers the chip-edge density required for massive scale-up and scale-out networks on 200G/lane switches, XPUs, and NICs.
Key features include:
Ultra-high density: Achieves highest density pluggable CPO through Ciena’s internally developed co-optimized design, combined with unique 2D fiber interconnect technology. This enables compatibility with the smallest co-packaged copper connectors such as Samtec’s CPX and supports high-performance 200G/lane deployments in space-constrained NICs, XPU servers, and leading-edge 100T and next-generation 200T switches.
Power reduction: Features retimer-free linear-drive operation, supporting a robust electrical loss budget of up to 20 dB from the host ASIC, enabling more flexible CPO architectures and saving up to 70% power versus traditional, retimed options.
Superior reliability: Designed with ultra-high availability in mind, from high volume external light source to internally developed SiGe drivers and TIAs co-optimized with temperature-stable silicon photonics Mach-Zehnder–based transmitters, and high density standard CPX compression-free electrical connectors.
New optical networking ecosystem: Provides access to an open, standards-based CPO ecosystem featuring a pluggable, CPX electrical interconnect and an IEEE802.3dj compliant optical interface enabling a flexible and diverse supply chain by promoting interoperability across multiple ASIC, optical, and electrical interconnect vendors.